Název: | Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbon |
Autoři: | Kalaš, David Kalčík, Jan Řeboun, Jan Soukup, Radek Hamáček, Aleš |
Citace zdrojového dokumentu: | KALAŠ, D. KALČÍK, J. ŘEBOUN, J. SOUKUP, R. HAMÁČEK, A. Stretch testing of SMD resistors contacted by a novel thermo-compression method on a textile ribbon. In 2021 44th International Spring Seminar on Electronics Technology : /proceedings/. Piscaway: IEEE, 2021. s. 1-5. ISBN: 978-1-66541-477-7 |
Datum vydání: | 2021 |
Nakladatel: | IEEE |
Typ dokumentu: | konferenční příspěvek ConferenceObject |
URI: | 2-s2.0-85114010077 http://hdl.handle.net/11025/49724 |
ISBN: | 978-1-66541-477-7 |
Klíčová slova v dalším jazyce: | contacting;smart textiles;stretch testing;thermo-compression |
Abstrakt: | This paper is focused on the dynamic stretch testing of SMD chip resistors which were contacted on a textile conductive ribbon by a thermo-compression method. In this method, the plastic housing made from Acrylonitrile Butadiene Styrene (ABS) material with a cavity for SMD component is placed on the textile ribbon, melted and subsequently cooled under continuous pressure (variant 1). The electrical contact resistance can be decreased by applying SnBi solder paste on the conductive textile pads (variant 2) or by realizing SnBi bumps on the leads of the SMD component (variant 3). Low-temperature solder based on Bismuth material can be melted altogether with plastic housing in one step. The electrical contact resistance was measured right after the manufacturing and subsequently after every 2000 stretching cycles up to 12000 cycles. |
Abstrakt v dalším jazyce: | This paper is focused on the dynamic stretch testing of SMD chip resistors which were contacted on a textile conductive ribbon by a thermo-compression method. In this method, the plastic housing made from Acrylonitrile Butadiene Styrene (ABS) material with a cavity for SMD component is placed on the textile ribbon, melted and subsequently cooled under continuous pressure (variant 1). The electrical contact resistance can be decreased by applying SnBi solder paste on the conductive textile pads (variant 2) or by realizing SnBi bumps on the leads of the SMD component (variant 3). Low-temperature solder based on Bismuth material can be melted altogether with plastic housing in one step. The electrical contact resistance was measured right after the manufacturing and subsequently after every 2000 stretching cycles up to 12000 cycles. |
Práva: | Plný text je přístupný v rámci univerzity přihlášeným uživatelům. © IEEE |
Vyskytuje se v kolekcích: | Konferenční příspěvky / Conference Papers (KET) Konferenční příspěvky / Conference papers (RICE) OBD |
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Soubor | Velikost | Formát | |
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Kalas_09467635.pdf | 4,33 MB | Adobe PDF | Zobrazit/otevřít Vyžádat kopii |
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http://hdl.handle.net/11025/49724
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