Název:	Study of Internal Stress in Conductive and Dielectric Thick Films
Autoři:	Hlína, Jiří Řeboun, Jan Janda, Martin Hamáček, Aleš
Citace zdrojového dokumentu:	HLÍNA, J. ŘEBOUN, J. JANDA, M. HAMÁČEK, A. Study of Internal Stress in Conductive and Dielectric Thick Films. Materials, 2022, roč. 15, č. 23, s. 1-12. ISSN: 1996-1944
Datum vydání:	2022
Nakladatel:	MDPI
Typ dokumentu:	článek article
URI:	2-s2.0-85143747369 http://hdl.handle.net/11025/50955
ISSN:	1996-1944
Klíčová slova v dalším jazyce:	thick film;silver;dielectric;internal stress;ceramics;cantilever method
Abstrakt v dalším jazyce:	This paper is focused on the study of internal stress in thick films used in hybrid microelectronics. Internal stress in thick films arises after firing and during cooling due to the differing coefficients of thermal expansion in fired film and ceramic substrates. Different thermal expansions cause deflection of the substrate and in extreme cases, the deflection can lead to damage of the substrate. Two silver pastes and two dielectric pastes, as well as their combinations, were used for the experiments, and the internal stress in the thick films was investigated using the cantilever method. Further experiments were also focused on internal stress changes during the experiment and on the influence of heat treatment (annealing) on internal stress. The results were correlated with the morphology of the fired thick films. The internal stress in the thick films was in the range of 8 to 21 MPa for metallic films and in the range from 12 to 16 MPa for dielectric films. It was verified that the cantilever method can be successfully used for the evaluation of internal stress in thick films. It was also found that the values of deflection and internal stress are not stable after firing, and they can change over time, mainly for metallic thick films.
Práva:	© authors
Vyskytuje se v kolekcích:	Články / Articles (RICE) Články / Articles (KET) OBD

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